TAMURA 低银锡膏GP-217-HF17衡鹏供
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田村 TAMURA 低银锡膏GP-217-HF17  衡鹏企业竭诚为您供应

1. Outstanding Features

3) Stable printability and shape of the printed solder paste are obtained with little change in viscosity

during continuous printing.

* Inspected the flux itself only

reduced, furthermore, the environment and the safe workplace are protected. As its flux residue contains no

halides, it can be remained on the PCB without cleaning.

LFSOLDER GP-217-HF17 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder

powder and special flux. Since this solder paste contains no Pb, the usage of hazardous materials is

Table 1 - The characteristics of LFSOLDER GP-217-HF17

1) Pb-free (Sn/Ag/Cu series) alloy solder is used.

2) Excellent wettability for electronic component and land pattern.

4) Excellent solderability is brought with the reflow profile with high peak temperature.

5) Superior reliability is ensured without cleaning the flux residue.

Items                       Characteristics            Test methods

Alloy composition           Sn 96.1 / Ag 1.0 /         JIS Z 3282 (1999)

Melting point               211??222??                 DSC measurement

Particle size of solder     20??36μm                  Laser diffraction method

Shape of solder powder      Spherical                  Annex 1 to JIS Z 3284 (1994)

Flux content                12.5%                      JIS Z 3284 (1994)

Chlorine content*           0.0%                       JIS Z 3197 (1999)

Viscosity                   200 Pa??s                  Annex 6 to JIS Z 3284 (1994)